Brand New
T862+ + IRDA Welder Infrared Heating Rework Station
BGA SMT SMD
2 years factory warranty
It can reflow any laptop video chip,XBOX360,motherboards ,PSP PS2 ,video card, mobile phone ,cell phone
Features :
※Unlike Air Re-Work systems, The T-862++ uses an Infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.
※Infrared soldering technology with independent exploration capabilities via three (3) focus lenses which are included with the package.
※Technician focused infrared heat is easy to target most component removal/replacement and re-work.
※The Workstation has a 120 X120mm a 650W controlled Pre-heating System.
※Infrared heat source bulbs are long-lived, in-expensive and easily replaced.
※Processor controlled set-point regulated temperatures with thermocouple feed-back.
※Integrated and adjustable Infrared (IR) eye protection.
※Can suitable for the entire component, especially Micro BGA component.
※The T-862++ system also contains a temperature controlled touch-up iron and stand.
※Extra soldering tools are not necessary to solder/unsolder and re-work Surface Mount Technology (SMT) components 15-35cm in size
※Training is illustrated in factory provided video.
Technical parameter :
Working Voltage :AC220V/50Hz AC110V/60Hz
Output power : 800W
Infra-red lamp body temperature adjustable : 100℃-350℃
Preheating dish temperature adjustable : 60℃-200℃
Components :
T-862++ Chassis : 1 x
PCB Board holder :1 x
936 Searing-iron : 1 x
936 searing-iron rack : 1 x
Lamp Body and Lens(D=28mm) : 1 x
Lens(D=38mm) : 1 x
Lens(D=48mm) : 1 x
Eye protection(IR Filter) : 1 x
Cell guide : 1 x
Focus holder : 1 x
Focus holder control knob : 1 x
Fasten nut for focus holder : 1 x
Steady ring : 1 x
Fasten nut for steady ring : 1 x
Power Cable (110VAC or 200VAC) : 1 x
5mm Fuse, 10A 250VAC (Spare) : 1 x
CD User Manual w/Video : 1 x
How to use :
1. Locate, choose and attach the appropriate lens:
The usable of the lenses diameter are 28mm, 38mm, 48mm
(1) When the area of the chips is below 15mm* 15mm, please choose the IR-lamp temperature
about 160-24013, and choose the lens which D=28mmto avoid destroying other places,
usually it will take you about 20-40seconds.
(2) When the area of the chips is between 15mm* 15mm and 30mm*30mm, please choose the
IR-lamp temperature about 240-32013, and choose the lens which D=38mm to avoid destroying
other places, usually it will take you about 30-60seconds.
(3) When the area of the chips is above 30mm*30mm, please choose the IR-lamp temperature
350l3(Attention: you should turn on the pre-heat dish first, and set-up the temperature about
150-20013 .wait 3-5minutes to allow the temperature steady on the set-up temperature),and
choose the lens which D=48mmto avoid destroying other places, and keep the lamp body direct
light. You should control the time carefully to avoid burning the chips.
Warning:
The light system will shoot straightly. Please pay more attention to yourself control time to
avoid burning out.
2. Open the machine
(1) Check if the connection wire of the lamp body and the 936-lron is ok.
(2) Locate and attach the power cable to the rear of the re-work station
(3) Confirm all front panel rocker switches are off.
(4) Place the rear AC Power Switch in the ON Position.
(5) Allow the T-862++ Power-On-Self-Test (POST) to complete.
(6) Temperature set-points will display last value used.
(7) Place the target PC Board on the slip-rack and orient to close proximity of estimated
position of focused Infrared light,
(8) Adjust the T-862++ Infrared light system height, allow 20-30mm from lens end to PC board
target component.
(9) Turn on the two switches. They control warm-up plate and light system.
3. PC Board Component Removal and Replacement.
(1) Putthe PCB board onto the holder
(2) Tum on the switch of the pre-heat dish, and set-up the temperature
(3) Tum on the switch of the IR-Lamp, Regulate the temperature (the temperature must be
warm enough to allow the solder to be liquefied), focus the Infrared light on the chip to
be removed.
(4) 0ncethe solder liquefied and melted, use tweezers to remove the chip.
4. Soldering a chip.
(1) Clean the target pad with the brush
(2) Then put the solder ball and a flat of solder flux on the target pad
(3) Turn on the switch of the pre-heatdish, and set-up the temperature
(4) Tum on the switch of the IR-Lamp, Regulate the temperature (the temperature must be
warm enough to allow the solder to be liquefied), focus the Infrared light on the chip to
be solder
(5) Wait to allow the Infrared lamp to heat the solderfluxto work as the solder balls on the
target chip pad reaches liquid temperature. Use tweezers or a vacuum device to place the
chip target position. Once the solder liquefies, the chip will be sold automatically.
After cooling the chip, pick up the PCB board, check if it is ok. If not, re-operate.
5. The use of the 936 searing-iron
It can be used separately, But be sure it must be connect with the chassis.
If the component is too small, you needn't use the IR-lamp, the 936 searing-iron is
enough.
Open the switch of the 936 searing-iron, set-up the temperature, then use it as you want.
We also have the relevant part, not included in this list. If you need, please contact us
A: 0.3mm leaded solder ball,250000PCS
B: 0.4mm leaded solder ball,250000PCS
C: 0.5mm leaded solder ball,250000PCS
D: 0.6mm leaded solder ball,250000PCS
E: 0.76mm leaded solder ball,250000PCS
Solder ball feature:
1.Solder ball alloy content: SN63PB37 (Sn 63% Pb 37%)
2.Melting point: 183 degrees Celsius.
F: genuine and original U.S. AMTECH solder paste ,100g
G: genuine and original U.S. AMTECH solder paste ,10cc
H: foil paper
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