T862 IRDA Welder Infrared SMT SMD BGA Rework Station

Brand New

T862 IRDA Welder Infrared SMT SMD BGA Rework Station

come with 2 year factory warranty

It can reflow any common laptop video chip,motherboards ,video card, mobile phone ,cell phone

Feature :

 ※ Unlike Air Re-Work systems, The T-862 uses an Infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.

 ※  Infrared soldering technology with independent exploration capabilities via one focus lenses which is included in the package.

 ※  Technician focused infrared heat is easy to target most component removal/replacement and re-work.

 ※  The Workstation has a 80 X120mm a 600W controlled Pre-heating System.

 ※  Infrared heat source bulbs are long-lived, in-expensive and easily replaced.

 ※  Processor controlled set-point regulated temperatures with thermocouple feed-back.

 ※  Integrated and adjustable Infrared (IR) eye protection.

 ※  Can suitable for the entire component, especially Micro BGA component.

 ※  The T-862 system also contains a temperature controlled touch-up iron and stand.

 ※  Extra soldering tools are not necessary to solder/unsolder and re-work Surface Mount Technology (SMT) components18*18cm in size

 ※  Training is illustrated in factory provided video
　

Technical parameter :

Working Voltage : AC220V/50Hz

                              AC110V/60Hz
Output power : 600W
Infra-red lamp body temperature adjustable :100℃-350℃
Preheating dish temperature adjustable :60℃-200℃

Components :

T-862 Chassis : 1 x
PCB Board holder : 1 x
936 Searing-iron : 1x
936 searing-iron rack :1x
Lamp Body and Lens(D=28mm) :1 x
Eye protection(IR Filter) : 1 x
Cell guide :1 x
Focus holder : 1 x
Focus holder control knob :1 x
Fasten nut for focus holder :1 x
Steady ring :1 x
Fasten nut for steady ring :1 x
Power Cable (110VAC or 200VAC) : 1 x
5mm Fuse, 10A 250VAC (Spare) : 1 x
CD User Manual w/Video : 1 x

Detailed English instructions and illustrations : 1 x

More information, please donot hesitate to contact us.

 Maintenance:

 At all times – Insure the light body cooling fan is unobstructed and clean.

 Use a little machine oil. Lubricate the focus holder and cell guide to inhibit rusting, keep them ease to operate.


Warning :

The T-862 System creates temperatures in excess of high degrees via Infrared Light. Wear appropriate eye protection or any device within The T-862 system when using this machine. After use, Do not cut the power immediately, confirm the light body is cool-to-touch, Turn off the power switch, then place the system in airiness & safety storage.

Do NOT use this system or any associated device in an environment conducive to fire or electrical overload.

Disconnect the AC Power Plug when not in use.
　

How to use :
　

1. Open the machine

(1) Check if the connection wire of the body lamp and the 936-lron is ok.

(2) Locate and attach the power cable to the rear of the re-work station

(3) Confirm all front panel rocker switches are off.

(4) Place the rear AC Power Switch in the ON Position.

(5) Allow the T-862 Power-On-Self-Test (POST) to complete.

(6) Temperature set-points will display last value used.

(7) Place the target PC Board on the slip-rack and orient to close proximity of estimated
position of focused Infrared light.

(8) Adjust the T-862 Infrared light system, allow 20-30mm from lens end to PC board target
component.

(9) Turn on the two switches. They control pre-heat dish and light system.

(10) According to the measurement of the chips to adjust the lamp temperature.

2. When the area of the chips is below 15mm*15mm,please choose the IR-lamp
temperature about 240-30013, When the area of the chips is below 25mm*25mm,please
choose the IR-lamp temperature about 3000-35013. At this time, the light shoot directly,
you should control the time carefully to avoid burning the chips.

Warning:

The light system will shoot straightly. Please pay more attention to yourself control time to avoid burning out.

3. PC Board Component Removal and Replacement.

(1) Putthe PCB board onto the holder

(2) Tum on the switch of the pre-heat dish, and set-up the temperature

(3) Tum on the switch of the IR-Lamp, Regulate the temperature (the temperature must be
warm enough to allow the solder to be liquefied), focus the Infrared light on the chip to
be removed.

(4) 0ncethe solder liquefied and melted, use tweezers to remove the chip.

4. Soldering a chip.

(1) Clean the target pad with the brush

(2) Then put the solder ball and a flat of solder flux on the target pad

(3) Turn on the switch of the pre-heatdish, and set-up the temperature

(4) Tum on the switch of the IR-Lamp, Regulate the temperature (the temperature must be
warm enough to allow the solder to be liquefied), focus the Infrared light on the chip to
be solder

(5) Wait to allow the Infrared lamp to heat the solderfluxto work as the solder balls on the
target chip pad reaches liquid temperature. Use tweezers or a vacuum device to place the
chip target position. Once the solder liquefies, the chip will be sold automatically.
After cooling the chip, pick up the PCB board, check if it is ok. If not, re-operate.

5. The use of the 936 searing-iron

It can be used separately, But be sure it must be connect with the chassis.

If the component is too small, you needn't use the IR-lamp, the 936 searing-iron is

enough.

Open the switch of the 936 searing-iron, set-up the temperature, then use it as you want.

We also have the relevant part, not included in this list. If you need, please contact us

A: 0.3mm leaded solder ball,250000PCS

B: 0.4mm leaded solder ball,250000PCS

C: 0.5mm leaded solder ball,250000PCS

D: 0.6mm leaded solder ball,250000PCS

E: 0.76mm leaded solder ball,250000PCS
  Solder ball feature:

   1.Solder ball alloy content: SN63PB37 (Sn 63% Pb 37%)

   2.Melting point: 183 degrees Celsius.
F: genuine and original U.S. AMTECH solder paste ,100g

G: genuine and original U.S. AMTECH solder paste ,10cc

H: foil paper